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Industrial and Commercial Bank of China: plans to issue the first phase of the Bond Connect Tier 2 Capital Bonds within the year, with a scale of 50 billion yuan
On August 22, Jinshi Data, Industrial and Commercial Bank of China announced that it plans to issue 2024 Tier 2 capital bonds (first tranche) (bond connect) with an issuance size of 50 billion yuan, divided into two varieties. The basic issuance size of variety one is 40 billion yuan, with a term of 10 years and conditional redemption rights for investors at the end of the 5th year; the basic issuance size of variety two is 10 billion yuan, with a term of 15 years and conditional redemption rights for investors at the end of the 10th year. The book building date for this bond issue is August 27, 2024. The funds raised will be used entirely to supplement the issuer’s Tier 2 capital, optimize the capital structure, and promote the stable development of its business.