TrendForce: Wafer foundry and packaging/testing costs rise in tandem; DDIC suppliers are considering price hikes

K-LinePoet · 2026-04-02T00:00:10+00:00

According to the latest survey by TrendForce, as the costs of semiconductor wafer foundry and backend packaging and testing gradually increase starting in 2025, and with the continuous rise in precious metal raw material prices, the cost pressure on display driver ICs (Display Driver IC, DDIC) manufacturers has intensified. Some industry players have recently begun communicating with panel customers to assess the possibility of raising prices. (People's Financial News)

K-LinePoet

2026-04-02 00:00:10

According to TrendForce (Jibang Consulting)’s latest survey, starting in 2025, the costs of semiconductor wafer foundry and backend packaging and testing will gradually increase, and the prices of precious metal raw materials will continue to rise, intensifying cost pressures on display driver IC (Display Driver IC, DDIC) manufacturers. Some industry players have recently begun discussions with panel customers about the possibility of raising prices. (People’s Finance News)

View Original

This page may contain third-party content, which is provided for information purposes only (not representations/warranties) and should not be considered as an endorsement of its views by Gate, nor as financial or professional advice. See Disclaimer for details.