Shenzhen: Accelerate applications of specialized printed circuit boards (high-speed and high-frequency communication), FCBGA/BT packaging substrates, etc.

People’s Financial News, March 25 — The Shenzhen Municipal Bureau of Industry and Information Technology recently issued the “Action Plan for Accelerating the High-Quality Development of the Artificial Intelligence Server Industry Chain in Shenzhen (2026–2028).” The plan proposes leveraging Shenzhen’s advantages as a global core manufacturing base for PCBs (printed circuit boards) to focus on developing high-layer, high-speed boards for AI servers, rigid-flex combined boards, flexible boards, advanced packaging substrates, ultra-high-layer HDI boards of 6 layers or more, and ABF substrates, promoting large-scale application of cutting-edge low-dielectric high-end substrates. It also emphasizes strengthening R&D and capacity deployment for high-end carrier-like substrates and flexible circuit boards, expanding small-scale and diversified custom PCB services to support enterprise R&D and pilot testing. The plan aims to accelerate applications such as specialized printed circuit boards (for high-speed, high-frequency communication), FCBGA/BT packaging substrates, supporting efficient interconnection of data centers and backbone networks.