此外，特斯拉在美国投入建造的巨型半导体芯片工厂 Terafab 项目已经启动。芯片工厂 Terafab 规模远超传统，将把逻辑 AI 芯片、内存和先进封装全部集成在同一个设施里生产。核心目标为每年生产 1000 亿至 2000 亿颗芯片，初始产能 10 万片晶圆/月，最终可扩至 100 万片/月，远超目前台积电、Intel 等主流工厂。马斯克初衷为应对特斯拉爆炸式的 AI 算力需求，给 Dojo 超级计算机、FSD 全自动驾驶、Optimus 机器人、Robotaxi 车队等提供自产芯片，避免依赖台积电、三星等外部供应商。

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