Kexiang Co., Ltd.: In the field of advanced HDI, the company has mastered 16-layer arbitrary layer interconnection technology.

Jin10 Data, August 28 - Kexiang Co., Ltd. stated on the interactive platform that in the high-end HDI field, the company has mastered 16-layer arbitrary layer interconnection technology and 30-45μm ultra-thin PP bonding technology. Currently, it has achieved laser blind hole diameters of 75±10μm, X-hole sizes of 75-100μm, line width and spacing of 50/50μm, blind hole plating aspect ratio of 0.8:1, and blind hole alignment accuracy of 50μm, among other technologies. The company will also continue to increase R&D investment in HDI products, enhance manufacturing capabilities, and match the latest technological developments with the demands for PCB products.

View Original
This page may contain third-party content, which is provided for information purposes only (not representations/warranties) and should not be considered as an endorsement of its views by Gate, nor as financial or professional advice. See Disclaimer for details.
  • Reward
  • Comment
  • Repost
  • Share
Comment
0/400
No comments
Trade Crypto Anywhere Anytime
qrCode
Scan to download Gate App
Community
English
  • 简体中文
  • English
  • Tiếng Việt
  • 繁體中文
  • Español
  • Русский
  • Français (Afrique)
  • Português (Portugal)
  • Bahasa Indonesia
  • 日本語
  • بالعربية
  • Українська
  • Português (Brasil)